Excerpted from the national "Blue Book on the Development of Power Electronic Devices Industry (2016-2020)" on the key points of power electronics development in 2016-2020
As we all know, the manufacturing industry is the main body of the national economy, the foundation of the nation, the tool of rejuvenation, and the foundation of a strong nation. Without a strong manufacturing industry, there would be no country and nation's prosperity. As one of the manufacturing industries, the power electronic device industry is a high-tech basic industry related to the national economy and people's livelihood, and it plays an important role in economic development, national defense construction and people's livelihood. The power electronic device industry is mainly the production of core power electronic chips and packaging, but it is also inseparable from the support of semiconductor and electronic materials, key components, manufacturing equipment, testing equipment and other industries. Its development requires both the upstream basic material industry Support requires the pull of the downstream device industry, and its industrial development is characterized by large investment and long cycle.
In order to establish my country's independent and internationally competitive power electronic device industry, it is recommended to focus on the following technologies and industries from 2016 to 2020, and formulate relevant technical standards for key materials. Among them, the short-term development goals are:
1. Material of key parts
(1) Develop materials for precision ceramic structural parts of flat-panel fully-crimped multiple racks to meet the needs of flat-panel fully-crimped IGBT manufacturing.
(2) Development of alumina (Al2O3) ceramic copper clad laminates, aluminum nitride (AlN) ceramic copper clad laminates, silicon nitride (Si3N4) ceramic copper clad laminates, aluminum-silicon carbide (AlSiC) substrates, silicon gels, soldering sheets (welding (Belt) and other key parts and materials to meet the needs of welding power module manufacturing.
2. Key material technical standards
It is recommended to develop flat-plate full crimping multi-bench precision ceramic structural parts, aluminum oxide (Al2O3) ceramic copper clad laminate (DBC and AMB process), aluminum nitride (AlN) ceramic copper clad laminate (DBC and AMB process), silicon nitride (Si3N4) ) Technical standards for ceramic copper clad laminates, aluminum-silicon carbide (AlSiC) substrates, silicone gels, solder tabs (strips) and other key component materials.
During the “Twelfth Five-Year Plan” period, my country’s power electronic device market accounted for an increasing share of the global market, and it has become the world’s largest demand market for high-power power electronic devices. During this period, the annual growth rate of my country’s power electronic device market is nearly 20%. However, we must realize that the import rate of my country's IGBT chips is still high, and the main market is still dominated by foreign companies, which seriously hinders the healthy development of my country's independent IGBT device industry. Therefore, as the core of the power electronic device industry, the development of key materials involved in the production of power electronic chips and packaging is particularly important. It plays a pivotal role in establishing my country's independent and internationally competitive power electronic device industry.