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Quick reference to basic technical data of thyristor series module products

2. The constituent materials in the module The component materials of the module: Thyristor, DCB (Ceramic Copper Clad Laminate), phase shift trigger control circuit, (protection circuit, feedback circuit, current, voltage sensor, single-chip microcomputer and above are included in the functional module) heat dissipation base plate, input and output electrodes, control signal Port and other components. 3, the chip used inside the module uses imported glass passivation square chip, produced in Germany. The chip withstand voltage of the module is 1200-2200V 4. Introduction to the internal insulation of the modules The isolation method in the module is: the thyristor and the heat dissipation base plate are separated by a DCB ceramic copper clad plate, the dielectric strength VISO≥2500VAC, the trigger circuit and the thyristor main circuit are electromagnetically isolated. The dielectric strength between them is ≥2000V. It is protected by elastic silicone gel and sealed with epoxy resin. 5, the circuit form of the module According to the needs of the load, the main circuit design of the thyristor mainly includes four circuit forms: three-phase rectification, three-phase AC, single-phase rectification, and single-phase AC. 6. What is the temperature coefficient of the output voltage of the module? The temperature coefficient is 600PPM/℃. 7. What is the rate of increase of the current (di/dt) and voltage (dv/dt) of the module? Current rise rate: 100A/μS 500V/μS 8. Whether there is protection function in the module Ordinary thyristor modules generally do not have protection inside. Functional products such as constant current and constant voltage control modules, intelligent motor control modules, and dual closed-loop DC speed control modules have overcurrent, phase loss, and overheat protection functions, according to customer needs. Type modules can also be customized with various protection functions. 9. The control signal of the module ±l2V regulated power supply requirements voltage range +12V ±0.5V, ripple voltage is less than 30mv; -12V±0.5V, ripple voltage is less than 30mv; for ±12V power supply accuracy is required ±0.5V; ripple voltage ≤10mv current capability The current of the ±12V power supply must be more than 2 times the actual working current. If a transformer rectified regulated power supply is used, the filter capacitor must be greater than 1000μF/25V. 10. Will harmonics be generated when the module is working? How much is the impact? The harmonics generated by the module during operation are the same as the traditional thyristor circuit, which will have an impact on the grid, but it is not serious. It is not a superposition of harmonics and does not affect the normal operation of other equipment. 11. What is the relationship between module input voltage and output voltage? AC module Vout=0~1.0Vin, three-phase rectifier module Vout=0~1.35Vin. Single-phase rectifier module Vout=0~0.9Vin. 12. Is the module an open-loop control system or a closed-loop control system? The thyristor smart module (such as full-control rectification, AC, etc.) is an open-loop control system; functional products with functional modules (such as constant current and constant voltage control modules, intelligent motor control modules, dual closed-loop DC speed control modules, etc.) are a Closed loop control system. 13. What is the difference between the use of an open-loop module and a closed-loop module? What is the difference in control? The open-loop module changes with the load and the power grid, and the closed-loop module does not change with the change within a certain load and power grid range (power grid ±20%, load change 60%). Open-loop module control power supply uses +12V, and closed-loop module control power supply uses ±12V. 14, the thyristor trigger pulse form in the module The thyristor trigger uses a wide pulse trigger, and the trigger pulse width is about 4ms (milliseconds). 15. Is the main circuit of the thyristor module fully controlled or half controlled? Is the trigger circuit fully controlled or half controlled? What is the difference between the trigger voltage of full control and half control? What is the difference in waveform? The main circuit of the thyristor is a fully-controlled bridge, and the trigger circuit is divided into half-controlled and fully-controlled. The half-control trigger voltage is 0~10V, and the full-control trigger voltage is all on after 7V. The half-control module waveform diagram has only three thyristor waveforms in one cycle, and the full-control module waveform diagram has six thyristor waveforms in one cycle. 16. What is the isolation method between the main circuit of the module and the trigger circuit? What is the isolation voltage? There are two isolation methods. The solid state relay adopts photoelectric isolation, and the other modules adopt electromagnetic isolation, and the isolation voltage is 2500VAC. 17. Why do modules nee

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Technical solutions for on-site use of thyristor series module products

 Time of issue: : 2013-05--27

(1) What is the difference between the voltage regulation function of the AC module and the transformer? The transformer can isolate the load from the grid, and transmit equal power according to the set transformation ratio; the AC module is not isolated from the grid and only regulates the grid voltage, and its transmission power is limited by the current and decreases as the voltage decreases. (2) What is the anti-interference ability of the module? The module is adapted to the large distortion of the power grid waveform, and can work normally even when the main circuit is working with high current, and the phase-shift trigger control system does not interfere with the connected computer or other control instruments, and has strong anti-interference ability. (3) What quality assurance does the module have? Products are produced in strict accordance with the company's technical standards and quality levels. If it is a quality problem of the supplier's product itself, the supplier will replace it within one year of sale. (4) Will the module generate harmonics when it is working? The harmonics generated by the module during operation are the same as the traditional thyristor circuit, which will affect the power grid, but according to the user's feedback, the impact on the power grid is relatively small. An example can be taken to illustrate this problem: the ratio of the output power controlled by the module to the power of the grid power transformer is a basis for determining the size of the impact. The grid power transformer has a relatively large capacity and can supply a larger current, while the output power of the module is relatively large compared to the transformer. If the power of the module is relatively small, its impact can be ignored; on the contrary, if the output power controlled by the module is relatively large relative to the power of the transformer, the impact will be relatively large. Power capacitors can be used to absorb when the impact is large, and LC can be used when necessary. (5) When the module is manually controlled, what are the requirements for the potentiometer used? The power of the potentiometer is ≥0.5W, and the resistance range is from 5.1 to 100K. (6) What should be paid attention to when cooling the module? The junction temperature of the module chip cannot exceed 125 degrees. When the module is working stably, the temperature of the heat sink should not exceed 80 degrees (ie the case temperature of the module), otherwise the module will be burnt out. (7) When the output of the user test module is abnormal, which aspects should be considered? 1) Whether the module has a load test. 2) Whether the 12V power supply meets the working requirements of the module. 3) If it is controlled by a microcomputer or an instrument, check whether there is a discharge circuit at the control end. Because there is a capacitor on pins 2 and 3 that may store charges, which will turn on when no signal is applied, a 500K resistor must be connected to pins 2 and 3. 4) If the user's test is unbalanced, first check whether the load is balanced, and whether the red and black test leads of the digital meter should be AB, BC, CA phase during the test. 5) Whether the wiring is correct, especially for single-phase AC modules, a neutral wire should be added to both sides. 6) If the module does not work normally when the user has inductive or capacitive load or the load is uncertain, it is recommended that the user test under pure resistive load. 7) When the control signal is uncertain, use potentiometer to adjust to check whether the module is normal.

Key insulating materials for power electronic modules

 Time of issue: : 2013-05--27

In the development of power semiconductor modules, with the increase in integration and the reduction in size, the power consumption per unit heat dissipation area has increased. Heat dissipation has become a key issue in module manufacturing. The traditional module structure (welded and crimped Formula) has been unable to successfully solve the heat dissipation problem. Therefore, new requirements are put forward for the thermally conductive insulating material between the heat dissipation base plate and the chip. At present, this kind of material used in the power electronics industry at home and abroad is generally a ceramic-metal composite board structure, referred to as DBC board (Dircet Bonding Copper). The so-called DBC technology refers to the technology of directly bonding copper to ceramic materials at high temperatures. The DBC board mainly uses thermally conductive and insulating ceramic substrates such as Al2O3, AIN, and BeO. Because BeO contains toxicity, it is rarely used in industry. Although AIN has good thermal conductivity and a coefficient of thermal expansion similar to that of silicon, its price is too high. Therefore, Al2O3 has been widely used as a thermally conductive insulating substrate for DBC boards, and AIN is also under development. At present, foreign DBC substrates have been put into industrial production and are widely used in power semiconductor modules, microwave transmission and sealing and other fields. Among the power semiconductors of the same power, the welded module of the DBC board, compared with the ordinary welded module, is not only small in size, light in weight, saving parts, but also has better thermal fatigue stability and higher integration. Domestic research in this area has just started, and industrial production has not yet been formed. The Institute of Electrical Insulation, Xi’an Jiaotong University, combined with the "Eighth Five-Year Plan" task of GTR module packaging structure, used DBC technology to develop Al2O3-Cu composite boards and provided them to Xi’an Institute of Power Electronics Technology, Beijing Power Electronics New Technology Research and Development Center, etc. Unit trial. Small batch production in the laboratory has been formed. The market prospects are impressive. The role of the DBC substrate in the power module is as follows: 1) As the carrier of the silicon chip, and there is no other material and connecting wire between the two. Circuit wiring substrate, the function is similar to PCB board. 2) Good insulation performance, separate conductive parts and heat dissipation parts. 3) Good heat dissipation performance. The heat generated by the silicon chip is transferred to the heat sink through the thermal oil. Therefore, DBC substrate is a substrate with excellent thermal conductivity and insulation performance. Al2O3-Cu substrate has the following excellent characteristics: 1) The thermal resistance is small, and the thermal expansion coefficient is the same as Al2O3, which is similar to silicon (7.4×10-5K-1). No transition layer is required during use. The silicon chip can be directly soldered on the DBC substrate; 2) Has good mechanical properties, adhesion>5000N/cm2, peel resistance>90N/cm; 3) Corrosion resistance, no deformation, can be used in the temperature range of -55℃～+860℃; 4) Excellent electrical insulation performance, porcelain plate withstand voltage>2.5KV; 5) Good thermal conductivity, the thermal conductivity is 24～28W/m·K; 6) Good weldability, reaching more than 95%. DBC board will be the basic material of structure and connection technology in future electronic circuits. When the traditional organic copper clad P.C. board cannot meet the thermal shock performance of the component, the DBC board will be used as the basic material for electronic components with high power dissipation. In use, because the thicker copper layer (0.3mm) can withstand higher current loads, under the same cross-section, only 12% of the conductor width of the usual PC board is required; good thermoelectric rate makes the dense installation of power chips become may. It can transmit more power in a unit volume and improve the reliability of the system and equipment. It can be widely used in the following related fields of power electronics: (1) Power semiconductor devices, such as IGBT, GTR, SIT, etc.; (2) Power control circuit; (3) Hybrid power circuit and new power structure unit; (4) Solid state relay and high frequency switch module power supply; (5) Temperature control unit of electronic heating device; (6) Inverter, motor speed control, AC non-contact switch; (7) Electronic ceramic devices. According to our research, the use of DBC technology to make BaTiO3 burnt copper electrodes has low contact resistance and superior performance compared with ordinary burnt silver electrodes and copper-plated electrodes; (8) Structural units in automotive electronics, aerospace and military technology. DBC technology is

Application of Intelligent Thyristor Module in Electric Control

 Time of issue: : 2013-05--27

The application of soft starter and energy-saving operation controller is shown in Figure 5: Solid state contactors, relays, industrial electric heating temperature control, precision temperature control of various semi-body special equipment, medium and high frequency heat treatment power supplies, electric welding equipment (rectifier welding machine, secondary rectifier welding machine, inverter welding machine) laser power supply, Excitation power supply, electroplating, electrolysis power supply, mechanical and electronic equipment power supply, urban trackless, electric traction, port ship crane, fan, water pump, rail crane, gantry planer, large crane drive, ultra-low frequency molten steel, mixing power supply, papermaking, textile. Urban water supply, sewage treatment, etc., it can be said that the electrical control ITPM in the power distribution system has an effect. 3. The application significance of ITPM ITPM is the concentrated embodiment of the digitalization, intelligence and modularization of power electronic products, which highly demonstrates the role of modern power electronic technology in electrical control. ITPM can be used not only in more complicated control situations, but also in general switch control situations, which is its major advantage. Due to its high switching speed and arc-free shutdown and other excellent characteristics, this will improve the quality and performance of the control. Greatly improved. The extensive and large-scale application of ITPM saves a lot of metal materials and greatly reduces the volume of its control system. It can also make very complicated multiple electrical control systems very simple. Centralized computer control is used to realize information management, and operation and maintenance costs are very low. The energy saving effect of ITPM is very obvious, which is of great significance to environmental protection. Fourth, concluding remarks The series of ITPM developed and produced by Linzi Yinhe High-Tech Development Co., Ltd. has been widely used due to its superior performance and has shown obvious social and economic benefits. It is a substitute product for traditional thyristor devices. With a wide range of applications and a broad market, it is a very ideal new generation of electrical control products. With the low-cost and large-scale entry of ITPM into the market, traditional electrical control products and technologies will undergo tremendous changes and enter a new era of electrical control of power electronics.

New trends in the development of power semiconductor modules

 Time of issue: : 2013-05--27

However, with the increase of module frequency and power, the general IGBT module structure with large internal parasitic inductance can no longer meet the needs of applications. In order to reduce the assembly parasitic inductance inside the module and minimize the overvoltage generated by the device during switching to meet the needs of FM high-power IGBT module packaging, ABB has developed a planar low-inductance module (ELIP) as shown in Figure 3. ). The main difference between this structure and the general traditional structure is: (1) It uses a lot of wide and thin copper sheets to overlap to form the emitter terminal and the collector terminal. When installed, it is parallel to the module copper base plate and is of equal length. The parallel wires are directly connected from the IGBT emitter to the emitter terminal, and the collector terminal is connected to the DBC board space position, thereby eliminating mutual inductance, limiting the proximity effect, and reducing the internal parasitic inductance; (2) many parallel connections Both the IGBT and FWD chips are soldered on the DBC board without graphics, and the emitter of the IGBT and the anode of the FWD are soldered with molybdenum buffer sheets. The current distribution is consistent with the rectified voltage conditions, which is beneficial for the module chip to work at the same temperature, which greatly improves the output and reliability of the module; (3) The module adopts a stacked design, which combines upper and lower insulation layers, upper and lower electrode terminals and printed circuits The plates are stacked on each other and glued together (to avoid air bubbles when bonding), which can be cycled well with temperature, without considering the so-called welding stress, that is, the so-called "S"-shaped electrode design. Since the IGBT of the MOS structure is voltage-driven, the driving power is small, and IC can be used to drive and control, and then developed to the IGBT chip, fast diode chip, control and drive circuit, overvoltage, overcurrent, overheating and undervoltage The intelligent IGBT module (IPM), which is packaged in the same insulating housing such as protection circuit, clamping circuit and self-diagnostic circuit, creates devices for high frequency, miniaturization, high reliability and high performance of power electronic inverters The foundation also simplifies the design of the complete machine, reduces the design, development and manufacturing costs of the complete machine, and shortens the time to market for the complete machine product. Because the IPM adopts a standardized grid control interface with logic level, the IPM can be easily connected to the control circuit board. The self-protection ability of IPM in the event of a fault reduces the damage of the device during development and use, and greatly improves the reliability of the whole machine.

Principle and Application of Double Closed Loop DC Speed Control Module

 Time of issue: : 2013-05--27

4. Concluding remarks The system is designed in the form of modules: high integration, small size, convenient wiring, simple adjustment, safe and reliable operation, and versatility, that is, the same module has the same parameters and is very convenient to use.